Semiconductor Packaging
Customer Challenges
Semiconductor packaging fails quietly — in yield, uptime and audit. These are the pain points we engineer out.
Static-sensitive components fail or silently degrade during handling and transit.
Particles and ionic residue reduce yield and threaten downstream cleanliness.
Chipping, scratches and coplanarity loss from poor nesting and handling.
Trays that don't index reliably stall pick-and-place and assembly lines.
Slow tooling delays device ramp and pushes out time-to-volume.
Distant, single-source packaging adds lead-time and validation risk.
Konix Solution
We design carriers, trays and shippers that are ESD-controlled and cleanroom-manufactured, shaped around your component geometry, automation and transit loop — then validate surface resistance and nesting before you commit to volume.
Applications
Business Benefits
ESD and contamination controlled by design, lowering field-failure and yield risk.
Process / Quality engineerRight-sized, reusable formats reduce packaging spend over the device lifecycle.
PurchasingReliable indexing and nesting steady the line and cut tray-related stoppages.
ManufacturingIn-house tooling and DFM shorten time-to-volume and de-risk validation.
FDI / plant managerEngineering Features
Conductive and dissipative materials specified and verified to your ESD requirement.
ISO Class 8 & 9 environments for forming, cleaning and packing.
Geometry-specific pockets that immobilise devices and protect fragile features.
We engineer with your team for fit to part, automation and transit.
Surface-resistance, drop and transit validation before volume.
CNC and soft-tool fabrication with secure, fire-protected mould storage.
Case Study
An IDM launching a System-in-Package faced ESD-related rejects and tray-driven line stoppages during ramp.
A co-designed dissipative carrier with validated surface resistivity and custom nesting, qualified before volume.
ESD-related rejects controlled · steadier line stability · lower packaging cost per unit.
Outcomes are directional and vary by device, geometry and validation scope. We model the expected result with you before tooling.
FAQ
Request a Solution
We'll propose an ESD-safe, validated solution — a recommendation, not a generic quote. A local engineering team in Đồng Nai. Your drawings and data stay confidential.
